Curing agents & hardeners

Typical Features & Benefits

  • Outstanding chemical & corrosion resistance
  • Excellent cross-linking property
  • Excellent amine blush & water-spotting
  • Excellent adhesion & bonding
  • High thermal stability
  • Good impact resistance
  • Excellent range of viscosity and reactivity
  • Long pot-life & working time
  • Can be cured at room & elevated temperatures
  • High versatility & compatibility
  • Sustains mechanical properties
  • CMR free & eco-friendly variants
  • Low color & low yellowing tendency
  • Suitable for different processing technologies
  • Minimizes labor & operational time
* These are not common to all hardeners within the portfolio. The choice of hardeners will be determined by the specific properties required by the application.
* CMR means Carcinogenic, Mutagenic, toxic to Reproduction
Product Family
Modified Aliphatic Amines
Modified Cycloaliphatic Amines
Phenolic Curing Agents
Waterborne Curing Agents
Fast Curing Agents
Modified Aliphatic Amines

Aliphatic Amines, modified to reduce their corrosive property while optimizing hardness, reactivity and working time, serve as top-notch Curing Agents. These room temperature cured Hardeners mostly offer good mechanical, adhesion & dielectric properties. Most Modified Aliphatic Amine Curing Agents provide systems with excellent corrosion & chemical resistance and high thermal stability. Usually yellow in color they tend to exhibit high yellowing over time. Across its range, Aliphatic Amine Curing Agents offer varying viscosities & reactivity and post-curing performance, making them suitable for a wide array of applications.

Given their excellent combination of properties, Modified Aliphatic Amine Curing Agents are widely used in protective coatings, fast-setting adhesives & mortars, construction & civil engineering, electrical & electronics and composite applications. They are also used for specialized applications like chemically resistant linings & mortars, solvent-free and high-solids coatings and for processes like lay-up laminating, electrical encapsulation, and filament winding.