CeTePox® AM XP 330 A : CeTePox® B / C
SOLVENT-FREE TOUGHENED HOT-MELT PREPREG EPOXY SYSTEM
Components
- CeTePox® AM XP 330 A-Low voscous toughened hot melt Epoxy Resin
- CeTePox® AM XP 330 B-Paste of Dicyandiamide in liquid Epoxy Resin
- CeTePox® AM XP 330 C-Paste of an accelerator in liquid Epoxy Resin
Features & Benefits
- Cured at elevated temperatures- 100-140°C
- Good drapability
- Controlled tack & flowability
- Good shelf-life at room temperature
- Excellent mechanical properties
- Increased thermal stability
- High fatigue resistance
- Optimized fibre-matrix adhesion
- Outstanding peel and inter-laminar shear strength
- Withstands thermal & hot wet stress
Applications
High-performance structural parts
Industrial
Properties
TDS
MSDS
Regulatory
Availability & Samples
CeTePox® AM XP 330 A
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CeTePox® AM XP 330 B
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CeTePox® AM XP 330 C
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System Properties
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