Epotec® YD 535 SP : Epotec® TH 8257 SP
SLOW REACTIVITY AMBIENT CURE EPOXY SYSTEM
Wet lay-up, RTM, RI, Pultrusion, Filament Winding, Vacuum/Pressure Bag Techniques & Contact Pressure Molding
Components
- Epotec® YD 535SP-Epoxy Resin
- Epotec® TH 8257SP-Hardener
Features & Benefits
- Low initial viscosity
- Fast & complete impregnation of fibres
- Can be cured at room temperature
- Optimum properties, when post cured at > 50°C
- Provides longer working time
- Low exothermic heat even for thick section of large parts
- Can be processed from 15°C to 50°C
- Fully cured component operates between -60°C to +80°C
- Excellent processing properties
- Excellent handling strength
- Faster strength build-up
- Suitable for laminate fabrication under varying environmental conditions
Properties
TDS
MSDS
Regulatory
Availability & Samples
Epotec® YD 535SP
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Epotec® TH 8257SP
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Processing properties
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